Infineon Signs Silicon Carbide Wafer Supply Agreement with Wolfspeed

Infineon Technologies AG and Wolfspeed entered a new multi-year supply agreement for 200-millimeter silicon carbide (SiC) wafers. The agreement will transition Infineon’s existing Wolfspeed supply relationship from 150-millimeter to 200-millimeter substrate technology. 

The agreement directly supports Infineon’s conversion to 200-millimeter SiC manufacturing, strengthening Infineon’s position as the global leader in power semiconductors and reinforcing the supply chain resilience that underpins its SiC growth strategy.

SiC semiconductors have become a key enabling technology for the electrification and energy efficiency applications that drive global decarbonization, from electric vehicles and renewable energy systems to AI data center power infrastructure. 

The transition to 200-millimeter SiC wafers delivers large manufacturing economics compared to 150-millimeter production. Larger wafer diameter increases usable die area per wafer, reduces per-unit substrate cost, and improves overall manufacturing efficiency. 

“Silicon carbide is at the heart of the energy transition, and securing a high-quality, resilient supply of 200-millimeter substrates is essential to delivering on our customers’ long-term commitments,” said Alexander Gorski, Chief Operations Officer at Infineon. “This agreement further broadens our strong supply base for our 200-millimeter high-volume manufacturing, building on a 20-year supply relationship between our two companies. It strengthens supply chain security for our customers and provides additional flexibility and scalability to support Infineon’s future growth.”